EMC Redesign & Compliance Engineering
When products fail EMC testing, we step in to diagnose the root cause and implement targeted redesign solutions. Our approach combines hands-on debugging with systematic engineering — ensuring that fixes are robust, cost-effective, and don’t compromise product performance.
Our Approach
EMC Failure Diagnosis
Systematic identification of emission and immunity failure mechanisms using near-field probing, spectrum analysis, and current path tracing. We pinpoint exactly where and why the product fails.
PCB & Schematic Redesign
Targeted modifications to grounding strategy, filtering, shielding, and layout — from minor component changes to full board respins when necessary. Every change is documented and justified.
Shielding & Filtering Solutions
Design and integration of EMI filters, ferrite placement, shielding cans, gaskets, and cable management solutions — optimized for both performance and production cost.
Pre-compliance Testing & Verification
In-house pre-compliance measurements to verify fixes before returning to the accredited lab — saving time and reducing the risk of repeated test failures.
Standards We Work With
Emissions: EN 55032, EN 55035, FCC Part 15, CISPR 32
Immunity: EN 61000-4-x series (ESD, surge, EFT, conducted immunity, radiated immunity)
Product Standards: EN 60601 (medical), EN 61010 (measurement), EN 62368 (AV/ICT)
Automotive: CISPR 25, ISO 11452, ISO 7637
Why Products Fail
Most EMC failures stem from inadequate grounding architecture, uncontrolled return current paths, or missing filtering at board and system boundaries. These issues are often invisible during functional testing but become critical during certification. We address the root cause — not just the symptom — so the fix holds across production variants and environmental conditions.